- Title
- Reliability Enhancements of Chip-on-Chip Package with Layout Designs of Microbumps
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系K. S. KaoC. J. Zhan
- Publication Details
- Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)
- Identifiers
- 9957771132206774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Reliability Enhancements of Chip-on-Chip Package with Layout Designs of Microbumps
Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)
2013
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