Reliability Estimation and Failure Mode Prediction for 3D Chip Stacking Package with the Application of Wafer-Level Underfill

Conference paper

C. C. Lee, T. F. Yang, C. S. Wu, K. S. Kao, R. C. Cheng and T. H. Chen

Materials for Advanced Metallization Conference (MAM 2012) Materials for Advanced Metallization Conference (MAM 2012)

2012

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Title: Reliability Estimation and Failure Mode Prediction for 3D Chip Stacking Package with the Application of Wafer-Level Underfill
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
T. F. Yang
C. S. Wu
K. S. Kao
R. C. Cheng
T. H. Chen
Identifiers: 9957769461706774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials for Advanced Metallization Conference (MAM 2012) Materials for Advanced Metallization Conference (MAM 2012)