Abstract
In this study, a chip-on-metal wafer level package (CoM-WLCSP) with stacking and fan-out capabilities, and a package-on-package (PoP) structure using this CoM-WLCSP are proposed. Moreover, the concept of the CoM-WLCSP and the process of fabricating this novel WLCSP are described. The parametric analysis of the CoM-WLCSP in board level is also studied by using the three-dimensional finite element model to determine a reliable stacking unit. Afterwards, a preliminary study of the PoP structure by finite element analysis is conducted. ©2006 IEEE.