- Title
- Reliability of Interfacial Adhesion in a Multi-Level Interconnect Structure
- Creators - without role
- C. C. ChiuH. H. ChangC. C. Lee - 國立清華大學工學院動力機械工程學系C. C. HsiaK. N. Chiang
- Publication Details
- 18th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2007) 18th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2007), pp.1506-1511
- Identifiers
- 9957771118606774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Reliability of Interfacial Adhesion in a Multi-Level Interconnect Structure
18th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2007) 18th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2007), pp.1506-1511
2007
Appears in keyword about Physics
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