- Title
- Residual Stress Effect of Through silicon Vias on the Operated Performance of Nano-Scaled Strained-Si Devices
- Creators - without role
- C. H. ChenP. C. HuangC. C. Lee - 國立清華大學工學院動力機械工程學系
- Identifiers
- 9957772637106774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Proceedings of the 40thConference on Theoretical and Applied Mechanics Proceedings of the 40thConference on Theoretical and Applied Mechanics
Conference paper
Residual Stress Effect of Through silicon Vias on the Operated Performance of Nano-Scaled Strained-Si Devices
Proceedings of the 40thConference on Theoretical and Applied Mechanics Proceedings of the 40thConference on Theoretical and Applied Mechanics
2016
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