- Title
- Residual Stress Investigation of TSVs on MOSFETs by Using Submodeling Finite Element Technique
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系C. H. ChenP. C. Huang
- Identifiers
- 9957776575306774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016 Joint Conference) IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016 Joint Conference)
Conference paper
Residual Stress Investigation of TSVs on MOSFETs by Using Submodeling Finite Element Technique
IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016 Joint Conference) IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016 Joint Conference)
2016
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