Retarding the Cu-Sn and Ag-Sn Intermetallic Compounds in the Cu/Sn/Cu-15Zn Microbump in 3D-IC Technology

Conference paper

W.Y. Chen and J.G. Duh

European Materials Research Society 2014 Fall Meeting European Materials Research Society 2014 Fall Meeting

2014

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Title: Retarding the Cu-Sn and Ag-Sn Intermetallic Compounds in the Cu/Sn/Cu-15Zn Microbump in 3D-IC Technology
Creators - without role: W.Y. Chen
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: European Materials Research Society 2014 Fall Meeting European Materials Research Society 2014 Fall Meeting
Identifiers: 9957776785306774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper