- Title
- SEM and EPMA Evaluation of Temperature Cycling Effects on Metallization Between Sn/Pb Solder and Pd/Ag Thick Film Conductor
- Creators - without role
- K. C. LiuJ. J. LiJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 11th R.O.C. Symposium on Electron Microscopy 11th R.O.C. Symposium on Electron Microscopy, pp.80-81
- Identifiers
- 9957771677606774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
SEM and EPMA Evaluation of Temperature Cycling Effects on Metallization Between Sn/Pb Solder and Pd/Ag Thick Film Conductor
11th R.O.C. Symposium on Electron Microscopy 11th R.O.C. Symposium on Electron Microscopy, pp.80-81
1990
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