Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology

Conference paper

Digest of Technical Papers - Symposium on VLSI Technology

2024

Abstract

Control pins;Data-rate;Fast-time;Low-costs;Miniaturisation;On demands;Packaging technologies;Routings;Scaled-up;Transmission interfaces

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Title: Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology
Creators - without role: 世杰張
Identifiers: 9957775594506774
Academic Unit: Department of Computer Science, College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: Digest of Technical Papers - Symposium on VLSI Technology