- Title
- Simulation-Based Prediction of Effective Modulus for a Through-Silicon Via (TSV) Silicon Interposer
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系Y. S. ShihC. S. Wu
- Publication Details
- Proceedings of the 35th Conference on Theoretical and Applied Mechanics Proceedings of the 35th Conference on Theoretical and Applied Mechanics
- Identifiers
- 9957777296306774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Simulation-Based Prediction of Effective Modulus for a Through-Silicon Via (TSV) Silicon Interposer
Proceedings of the 35th Conference on Theoretical and Applied Mechanics Proceedings of the 35th Conference on Theoretical and Applied Mechanics
2011
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