Abstract
There are many portable electronic products made by fan-out wafer/panel level package (FOWLP/FOPLP). The redistribution layer(RDL) design with fine pitch to connect inter each application is used. However, the above packaging products usually face the issue of electromigration (EM). Hence, a finite-element-based simulation method to predict the EM/ thermomigration (TM)/ stressmigration (SM) physical reliability and experimental validation are proposed. In this research, the EM simulation method also considers other physical behaviors including stress and temperature effects for future applications such as stretchable and foldable electric products.