Simulation for Copper Stress-Induced Voiding at Via Bottom and Its Microstructure Dependence

Conference paper

Robin C. J. Wang, L. D. Chen, C. C. Lee, K. Wu and K. S. Chang-Liao

2006 ANSYS Taiwan User Conference 2006 ANSYS Taiwan User Conference, pp.147-152

2006

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Title: Simulation for Copper Stress-Induced Voiding at Via Bottom and Its Microstructure Dependence
Creators - without role: Robin C. J. Wang
L. D. Chen
C. C. Lee - 國立清華大學工學院動力機械工程學系
K. Wu
K. S. Chang-Liao
Publication Details: 2006 ANSYS Taiwan User Conference 2006 ANSYS Taiwan User Conference, pp.147-152
Identifiers: 9957772878206774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper