Six Sigma based approach to enhance the PCB yield

Li-Fei Chen; Hung-Chun Lin; Hui-Po Hsu; Chao-Ton Su

Back

Conference paper

Six Sigma based approach to enhance the PCB yield

Li-Fei Chen, Hung-Chun Lin, Hui-Po Hsu and Chao-Ton Su

Proceedings - 19th ISSAT International Conference on Reliability and Quality in Design, RQD 2013, pp.20-23

2013

Abstract

DMAIC

Printed circuit board

Six Sigma

This paper presents a case study that a PCB company applies DMAIC-based Six Sigma methodology to improve product yield and to reduce discarding cost. According to the analysis, the inner layer open is one of the reasons that results in PCBs defect units in this case. After improving the manufacturing process, the PCBs defect units were successfully reduced from 82,100 to 69,700 defects per million, generating a cost savings of US1.41 million.

Metrics

1 Record Views

Details

Title: Six Sigma based approach to enhance the PCB yield
Creators - without role: Li-Fei Chen - Fu Jen Catholic University
Hung-Chun Lin - Department of Industrial Engineering and Engineering Management , National Tsing Hua University
Hui-Po Hsu - Department of Industrial Engineering and Engineering Management , National Tsing Hua University
Chao-Ton Su - Department of Industrial Engineering and Engineering Management , National Tsing Hua University
Identifiers: 9780976348696; 9957771563206774
Academic Unit: National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: Proceedings - 19th ISSAT International Conference on Reliability and Quality in Design, RQD 2013, pp.20-23

Six Sigma based approach to enhance the PCB yield

Abstract

Related links

Metrics

Details

National Tsing Hua University Social media