- Title
- Sn Whiskers Growth on Electroplated Leadfree Solder Finish for Advanced Flexible Electronic Packaging
- Creators - without role
- Shih-kang LinYuhi YorikadoKeun-Soo KimKatsuaki SuganumaSinn-wen Chen - 國立清華大學工學院化學工程學系Masanobu TsujimotoIsamu Yanada
- Publication Details
- 2006 Sanken International Symposium on Nanoscience and Nanotechnology (SISNN-2006) 2006 Sanken International Symposium on Nanoscience and Nanotechnology (SISNN-2006)
- Identifiers
- 9957767843106774
- Academic Unit
- Department of Chemical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Sn Whiskers Growth on Electroplated Leadfree Solder Finish for Advanced Flexible Electronic Packaging
2006 Sanken International Symposium on Nanoscience and Nanotechnology (SISNN-2006) 2006 Sanken International Symposium on Nanoscience and Nanotechnology (SISNN-2006)
2006
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