- Title
- Solder Joint of Sn-Ag and Sn-Ag-Zn with Cu and Pt-Ag Metallization
- Creators - without role
- Y.Y. WeiJ.G. Duh - 國立清華大學工學院材料科學工程學系Y.G. LeeB.S. Chiou
- Publication Details
- 1998 Proceedings Pan Pacific Microelectronics Symposium 1998 Proceedings Pan Pacific Microelectronics Symposium
- Identifiers
- 9957768050106774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Solder Joint of Sn-Ag and Sn-Ag-Zn with Cu and Pt-Ag Metallization
1998 Proceedings Pan Pacific Microelectronics Symposium 1998 Proceedings Pan Pacific Microelectronics Symposium
1998
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