Solidification properties and interfacial reactions with Ag and Ni substrates of Sn-In Solders with Zn addition

Conference paper

C.-F. Yang and S.-W. Chen

2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會 2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會

2009

Abstract

Solidification properties;interfacial reactions;Ag;Ni;Sn-In Solders;Zn addition

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Title: Solidification properties and interfacial reactions with Ag and Ni substrates of Sn-In Solders with Zn addition
Creators - without role: C.-F. Yang
S.-W. Chen - 國立清華大學工學院化學工程學系
Publication Details: 2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會 2009台灣化學工程學會第56屆年會暨國科會化工學門成果發表會
Identifiers: 9957775045306774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper