- Title
- Solution of Warpage Improvement for Embedded Interposer Carrier Integrated into 3D-ICs Packaging
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系R. C. ChengY. M. LinH. N. LiuY. Y. LiouT. C. Chang
- Publication Details
- International Interconnect Technology Conference/ Materials for Advanced Metallization Conference (IITC/MAM 2015) International Interconnect Technology Conference/ Materials for Advanced Metallization Conference (IITC/MAM 2015)
- Identifiers
- 9957771846406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Solution of Warpage Improvement for Embedded Interposer Carrier Integrated into 3D-ICs Packaging
International Interconnect Technology Conference/ Materials for Advanced Metallization Conference (IITC/MAM 2015) International Interconnect Technology Conference/ Materials for Advanced Metallization Conference (IITC/MAM 2015)
2015
Metrics
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