Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

Conference paper

E. J. Marinissen, F. Fodor, A. Podpod, M. Stucchi, Y.-R. Jian and C.-W. Wu

2018 IEEE International Test Conference (ITC)

10/2018

Abstract

Multiple;Multi-Die;Integrated Circuits

Computer Science

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Title: Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits
Creators - without role: E. J. Marinissen
F. Fodor
A. Podpod
M. Stucchi
Y.-R. Jian
C.-W. Wu
Identifiers: 9957773545906774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 2018 IEEE International Test Conference (ITC)