Special issue on IEEE/ACM System Level Interconnect Prediction (SLIP) Workshop 2016

Conference paper

Peer reviewed

Tsung-Yi Ho and Baris Taskin

Integration, the VLSI Journal, Vol.58, p.225

06/2017

Abstract

Software

Hardware and Architecture

Electrical and Electronic Engineering

1 Record Views

Title: Special issue on IEEE/ACM System Level Interconnect Prediction (SLIP) Workshop 2016
Creators - without role: Tsung-Yi Ho - National Tsing Hua University
Baris Taskin - Drexel University
Publication Details: Integration, the VLSI Journal, Vol.58, p.225
Identifiers: 9957774500206774
Academic Unit: National Tsing Hua University
Language: English
Resource Type: Conference paper