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Special session: Hot topic design and test of 3D and emerging memories
Conference paper

Special session: Hot topic design and test of 3D and emerging memories

Cheng-Wen Wu
Proceedings of the IEEE VLSI Test Symposium, p.328
2011
DOI: https://doi.org/10.1109/VTS.2011.5783744

Abstract

Electrical and Electronic Engineering Computer Science Applications
In this hot topic session, we are including three talks that cover design of reliable, emerging memories, with emphasis on 3D memories, DRAM and non-volatile memories. We will also introduce a new class of memory, the Storage Class Memory (SCM), and discuss its reliability issues. © 2011 IEEE.

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