Stability of twin boundary junction structure in nanotwinned copper nanowires prepared by pulsed electrodeposition

Conference paper

C. L. Huang and C. N. Liao

Materials Research Society 2016 Spring meeting

2016

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Title: Stability of twin boundary junction structure in nanotwinned copper nanowires prepared by pulsed electrodeposition
Creators - without role: C. L. Huang
C. N. Liao - 國立清華大學工學院材料科學工程學系
Identifiers: 9957774729106774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials Research Society 2016 Spring meeting