- 題名
- Stabilization of dendritic copper wick structure through a two-step electrodeposition process
- 創作者：
- J.-H. Liao (作者)Chien-Neng Liao - 國立清華大學, 半導體研究學院
- 會議
- TMS 2024 153rd Annual Meeting & Exhibition (Orlando, Florida, USA, 03/03/2024–07/03/2024)
- 學術資源類型
- 會議論文
- 語言
- 英語
會議論文
Stabilization of dendritic copper wick structure through a two-step electrodeposition process
TMS 2024 153rd Annual Meeting & Exhibition (Orlando, Florida, USA, 03/03/2024–07/03/2024)
指標
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