Logo image
Standard CMOS Integrated Ultra-Compact Micromechanical Oscillating Active Pixel Arrays
Conference paper

Standard CMOS Integrated Ultra-Compact Micromechanical Oscillating Active Pixel Arrays

Kalyani Bhosale, Chao-Yu Chen, Ming-Huang Li and Sheng-Shian Li
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2021-January, pp.157-160
01/2021

Abstract

arrays BEOL CMOS-MEMS nonlinear vibration oscillators phase noise resonant pixels resonators Electronic Optical and Magnetic Materials Condensed Matter Physics Mechanical Engineering Electrical and Electronic Engineering
This work demonstrates an ultra-compact low power oscillating micromechanical active pixel array based on a 0.35 μm back-end of line (BEOL)-embedded CMOS-MEMS technology. Each pixel consists of a 3-MHz clamped-clamped beam (CCB) MEMS resonator and a power scalable transimpedance amplifier (TIA) that occupies a small area of 70 × 60 μm and draws only 85 μW/pixel. The MEMS resonator is placed next to the TIA with less than 10 μm spacing thanks to the well-defined etch stops in the titanium nitride composite (TiN-C) CMOS-MEMS platform. A multiplexing phase-locked loop (PLL)-driven oscillator is employed to demonstrate the chip functionality. In particular, a nonlinear operation of the resonator tank is used to optimize the phase noise (PN) performance and Allan deviation (ADEV) behavior. The ADEV of 420 ppb averaged over best 3-pixels is exhibited based on such a nonlinear vibration operation.

Metrics

1 Record Views

Details

Logo image