- Title
- Stress Analysis of Micro-Bump Bonding Structure for Chip-on-Glass Packaging
- Creators - without role
- S.-M. ChangJ.-H. Jou - 國立清華大學工學院材料科學工程學系H.-S. WuH.-Y. LinC.-Y. Wu
- Identifiers
- 9957777311406774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Proceeding of the 5th Asian Symposium on Information Display, p.79-83 Proceeding of the 5th Asian Symposium on Information Display, p.79-83, pp.79-83
Conference paper
Stress Analysis of Micro-Bump Bonding Structure for Chip-on-Glass Packaging
Proceeding of the 5th Asian Symposium on Information Display, p.79-83 Proceeding of the 5th Asian Symposium on Information Display, p.79-83, pp.79-83
1999
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