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Stress Distribution Prediction of 3D-IC Integration by Using Transient Selective Annealing Approach
Conference paper

Stress Distribution Prediction of 3D-IC Integration by Using Transient Selective Annealing Approach

C. C. Lee, T. L. Tzeng and C. C. Huang
Proceedings of the 37th Conference on Theoretical and Applied Mechanics Proceedings of the 37th Conference on Theoretical and Applied Mechanics
2013

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