Stress Estimation of Thermo-Mechanical Behavior for Copper TSV Stacking Films Induced by Transient Selective Annealing Technology

Conference paper

C. C. Lee, T. L. Tzeng, Y. J. Lai and C. C. Huang

TACT 2013 International Thin Films Conference TACT 2013 International Thin Films Conference

2013

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Title: Stress Estimation of Thermo-Mechanical Behavior for Copper TSV Stacking Films Induced by Transient Selective Annealing Technology
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
T. L. Tzeng
Y. J. Lai
C. C. Huang
Publication Details: TACT 2013 International Thin Films Conference TACT 2013 International Thin Films Conference
Identifiers: 9957771739106774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper