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Stress Failure Estimation of 3D-IC Integrations by Using Embedded Interposers
Conference paper

Stress Failure Estimation of 3D-IC Integrations by Using Embedded Interposers

C. C. Lee, B. T. Chian, J. S. Hsu and H. N. Liu
Proceedings of the 31th National Conference on Mechanical Engineering (CSME) Proceedings of the 31th National Conference on Mechanical Engineering (CSME)
2014

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