Stress in Copper-Polyimide-Silicon Trilayer Structure

Conference paper

J.-H. Jou, J. Huang and D. C. Hofer

First Pacific Polymer Conference First Pacific Polymer Conference, p.199

1989

Metrics

1 Record Views

Title: Stress in Copper-Polyimide-Silicon Trilayer Structure
Creators - without role: J.-H. Jou - 國立清華大學工學院材料科學工程學系
J. Huang
D. C. Hofer
Identifiers: 9957776082306774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: First Pacific Polymer Conference First Pacific Polymer Conference, p.199