Study of Heat-Dissipation Rate and Thermal Deformation of TECs with SWCNT Coated Heat Sink

Conference paper

Y. S. Lin, T. W. Kan, 偉中王, J. R. Lin and C. H. Chang

International Conference on Advanced Technology in Experimental Mechanics 2019 (ATEM’19)

2019

Abstract

Heat-Dissipation Rate;Thermal Deformation;TEC

1 Record Views

Title: Study of Heat-Dissipation Rate and Thermal Deformation of TECs with SWCNT Coated Heat Sink
Creators - without role: Y. S. Lin
T. W. Kan
偉中王
J. R. Lin
C. H. Chang
Publication Details: International Conference on Advanced Technology in Experimental Mechanics 2019 (ATEM’19)
Identifiers: 9957771343206774
Academic Unit: Center for India Studies, Office of Academic Affairs, National Tsing Hua University
Language: English
Resource Type: Conference paper