- Title
- Study of Lamina Fracture of Cu/Low-k Interconnects Using the J-Integral Method
- Creators - without role
- C. C. ChiuC. C. Lee - 國立清華大學工學院動力機械工程學系K. N. Chiang
- Publication Details
- 7th International Conference on Fracture and Strength of Solids (FEOFS 2007) 7th International Conference on Fracture and Strength of Solids (FEOFS 2007)
- Identifiers
- 9957776398906774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Study of Lamina Fracture of Cu/Low-k Interconnects Using the J-Integral Method
7th International Conference on Fracture and Strength of Solids (FEOFS 2007) 7th International Conference on Fracture and Strength of Solids (FEOFS 2007)
2007
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