Study of Stress and Warpage Estimate of FOWLP under Hygro-Thermal Coupling Loading Condition

Conference paper

Y.-W. Huang, R.A. Kumar Yadav, H.-Y. Lin, C.-H. Lee and 昌駿李

Proceedings - Electronic Components and Technology Conference, pp.1599-1602

2024

Abstract

Wafer level packaging;Wafer Warpage;Finite Element Analysis;Reliability Analysis

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Title: Study of Stress and Warpage Estimate of FOWLP under Hygro-Thermal Coupling Loading Condition
Creators - without role: Y.-W. Huang - Industrial Technology Research Institute
R.A. Kumar Yadav
H.-Y. Lin - National Tsing Hua University
C.-H. Lee - National Tsing Hua University
昌駿李
Publication Details: Proceedings - Electronic Components and Technology Conference, pp.1599-1602
Identifiers: 9957776891806774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Conference paper