Abstract
Film deposition on micro-trenches by dual ion beam sputtering indeed increases the deposited film uniformity at the whole side-wall and lowers the protrusions at the top corner of the micro-trench since the directional film deposition and the film trimming process are carried out simultaneously by the designed dual ion beam system. From the current study, the dual ion beam system has the high potential to obtain uniform film on a micro-trench of high aspect ratio.