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Sub-3 DB Insertion Loss Broadband Acoustic Delay Lines and High Fom Resonators in LiNbO3/SiO2/Si Functional Substrate
Conference paper

Sub-3 DB Insertion Loss Broadband Acoustic Delay Lines and High Fom Resonators in LiNbO3/SiO2/Si Functional Substrate

Chun-Chen Yeh, Chia-Hsien Tsai, Guan-Lin Wu, Tzu-Hsuan Hsu and Ming-Huang Li
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2023-January, pp.1194-1197
2023

Abstract

acoustic delay lines and piezoelectric transducers lithium niobite MEMS SAW resonators Electronic Optical and Magnetic Materials Condensed Matter Physics Mechanical Engineering Electrical and Electronic Engineering
This work demonstrates high-performance shear-horizontal surface acoustic wave (SH-SAW) delay lines at 910 MHz with low insertion loss (IL) of 2.6 dB and wide fractional bandwidth (FBW) of 8.8% in thin film LiNbO3/SiO2/Si functional substrate. The SH-SAW acoustic delay lines (ADLs) based on X-cut LiNbO3 thin film and gold (Au) electrodes show a group velocity (Vg) of 4,300 m/s and a propagation loss of 10.1 dB/mm, which yields an effective quality factor (QPL) of 675. To validate the QPL from the delay line measurement, a 969 MHz one-port SH-SAW resonator at a similar operation frequency was designed on the same chip and presents high effective electromechanical coupling factor (keff2) up to 38.5% and maximum Bode-Q (Qmax) of 848, resulting in a high figure-of-merit (FoM) of 326. The low-loss behavior of SH-SAW devices illustrates the potential of LiNbO3/SiO2/Si functional substrates for RF signal processing and cross-domain applications.

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