Synthesis and Application of Novel Lead-free Solders Developed from Sn-based Nanoparticles

Conference paper

L. Y. Hsiao, G. J. Chiou, J. G. Duh and S. Y. Tsai

7th International Conference on Electronics Packaging Technology 7th International Conference on Electronics Packaging Technology

2006

Metrics

1 Record Views

Title: Synthesis and Application of Novel Lead-free Solders Developed from Sn-based Nanoparticles
Creators - without role: L. Y. Hsiao
G. J. Chiou
J. G. Duh - 國立清華大學工學院材料科學工程學系
S. Y. Tsai
Publication Details: 7th International Conference on Electronics Packaging Technology 7th International Conference on Electronics Packaging Technology
Identifiers: 9957766811306774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper