摘要
Terahertz waves can penetrate many optically opaque materials and carry interior object information in the response, so terahertz waves can be used as an effective tool in semiconductor circuit inspection and material analysis. This work proposes to use the single-pixel imaging system to explore material analysis based on the tensor compressive sensing model. This research proposes a practical estimation model and derives a time-delay model for estimating material refractive index and thickness from multiple echoes produced by the complete transient response of terahertz waves penetrating the objects with different material compositions.