- Title
- The Accompanied Effects of Process-Oriented and Temperature Cycling Loadings on the Warpage of Thin-Type 3D-ICs Packaging Structure and the Creep Behavior of Microjoints
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系H.C.LiuC. P. Hsieh
- Publication Details
- Proceedings of the 34th National Conference on Mechanical Engineering (CSME) Proceedings of the 34th National Conference on Mechanical Engineering (CSME)
- Identifiers
- 9957768259606774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
The Accompanied Effects of Process-Oriented and Temperature Cycling Loadings on the Warpage of Thin-Type 3D-ICs Packaging Structure and the Creep Behavior of Microjoints
Proceedings of the 34th National Conference on Mechanical Engineering (CSME) Proceedings of the 34th National Conference on Mechanical Engineering (CSME)
2017
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