- Title
- The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint
- Creators - without role
- C. F. TsengI. D. WangT. K. LeeK. C. LiuC. Y. ChengJ. WangJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- TMS 2012 141th Annual Meeting & Exhibition TMS 2012 141th Annual Meeting & Exhibition
- Identifiers
- 9957770112106774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint
TMS 2012 141th Annual Meeting & Exhibition TMS 2012 141th Annual Meeting & Exhibition
2012
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