The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test

Conference paper

C. Lee, W. Y. Chen, T. T. Chou, Tae Kyu Lee and J. G. Duh

Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015

2015

Metrics

1 Record Views

Title: The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test
Creators - without role: C. Lee
W. Y. Chen
T. T. Chou
Tae Kyu Lee
J. G. Duh - 國立清華大學工學院材料科學工程學系
Identifiers: 9957772002606774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015