- Title
- The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow
- Creators - without role
- Y. T. LiaoJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 6th International Symposium on Advanced Plasma Science and its Application for Nitirde and Nanomaterials 6th International Symposium on Advanced Plasma Science and its Application for Nitirde and Nanomaterials
- Identifiers
- 9957769661006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow
6th International Symposium on Advanced Plasma Science and its Application for Nitirde and Nanomaterials 6th International Symposium on Advanced Plasma Science and its Application for Nitirde and Nanomaterials
2014
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