The Pd Influence on Growth Behavior of Quaternary (Cu, Ni, Pd)6Sn5 Compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P Solder Joint during Liquid State Reaction

Conference paper

C. F. Tseng and J. G. Duh

E-MRS 2012 Spring Meeting E-MRS 2012 Spring Meeting

2012

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Title: The Pd Influence on Growth Behavior of Quaternary (Cu, Ni, Pd)6Sn5 Compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P Solder Joint during Liquid State Reaction
Creators - without role: C. F. Tseng
J. G. Duh - 國立清華大學工學院材料科學工程學系
Identifiers: 9957775851806774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: E-MRS 2012 Spring Meeting E-MRS 2012 Spring Meeting