- Title
- The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics
- Creators - without role
- T. T. ChouJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- Materials Science & Technology 2016 Materials Science & Technology 2016
- Identifiers
- 9957771110706774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics
Materials Science & Technology 2016 Materials Science & Technology 2016
2016
Metrics
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