The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint

Conference paper

C. Fleshman, W. Y. Chen, T. T. Chou, T. K. Lee, Tae Kyu Lee and J. G. Duh

Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015

2015

Metrics

1 Record Views

Title: The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint
Creators - without role: C. Fleshman
W. Y. Chen
T. T. Chou
T. K. Lee
Tae Kyu Lee
J. G. Duh - 國立清華大學工學院材料科學工程學系
Identifiers: 9957773038806774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015