The investigation of interfacial and crystallographic observation in the Ni(V)/ SAC/OSP Cu solder joints with high and low silver content during thermal cycling

Conference paper

C. Lee, W. Y. Chen, T. T. Chou, T. K. Lee and J. G. Duh

中國材料科學學會年會中國材料科學學會年會

2015

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Title: The investigation of interfacial and crystallographic observation in the Ni(V)/ SAC/OSP Cu solder joints with high and low silver content during thermal cycling
Creators - without role: C. Lee
W. Y. Chen
T. T. Chou
T. K. Lee
J. G. Duh - 國立清華大學工學院材料科學工程學系
Identifiers: 9957769095506774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 中國材料科學學會年會中國材料科學學會年會