The motivation and challenges of direct writing on semiconductor wafers

B.J. Lin

doi:10.1109/IMNC.2002.1178527

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Conference paper

The motivation and challenges of direct writing on semiconductor wafers

B.J. Lin

2002 International Microprocesses and Nanotechnology Conference, MNC 2002, pp.28-29

2002

DOI: https://doi.org/10.1109/IMNC.2002.1178527

Abstract

Hardware and Architecture

Electrical and Electronic Engineering

For decades, catadioptric optical lithography has continuously been incrementally extended to meet the need of the semiconductor industry. The three parameters to improve resolution, wavelength, numerical aperture (NA) and k ₁ reduction, are reaching their limits. The author reviews the motivations and challenges to meet present and near future demands.

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Title: The motivation and challenges of direct writing on semiconductor wafers
Translated title: The motivation and challenges of direct writing on semiconductor wafers
Creators - without role: B.J. Lin - Taiwan Semiconductor Manufacturing Company (Taiwan)
Publication Details: 2002 International Microprocesses and Nanotechnology Conference, MNC 2002, pp.28-29
Identifiers: 4891140313; 9784891140311; 9957777200806774
Academic Unit: Institute of Photonics Technologies, College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Conference paper

The motivation and challenges of direct writing on semiconductor wafers

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