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The numerical study of mechanical improvement of the metal annealing process during the manufacturing of the IC backend Damascene structure.
Conference paper

The numerical study of mechanical improvement of the metal annealing process during the manufacturing of the IC backend Damascene structure.

P.Y. Sun, Yuan Cadmus C.a and K.N. Chiang
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2022-October
2022

Abstract

annealing Cu/low-k Damascene process IC manufacturing wire bonding Hardware and Architecture Control and Systems Engineering Electrical and Electronic Engineering
This research establishes a set of transient finite element models to represent the mechanical impacts during the w/b process. Moreover, a finite element model of the BEOL structure, which consisted of 7 layers of copper metal stacks and an aluminum pad to represent the current frequent-used technology, is established to investigate the stress pattern. The results show that the Cu/low-k system produces larger stress levels in the column structure and induces a larger amount of deformation than the Al/TEOS system, and different annealing temperatures can affect the deformation behavior of the Cu stack.

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