Thermal Performance Analysis of Micro Pillars and Channels under Boiling and Dry-out Phenomena

Conference paper

S.W. Chen, M.L. Chai, F.J. Kuo, F.C. Liu, W.K. Lin, J.R. Wang, J.D. Lee, H.T. Lin and C. Shih

Asia-Pacific Conference of Transducers and Micro-Nano Technology 2016 Asia-Pacific Conference of Transducers and Micro-Nano Technology 2016

2016

Abstract

Thermal Performance;Micro Pillars;Channels;Boiling;Dry-out Phenomena

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Title: Thermal Performance Analysis of Micro Pillars and Channels under Boiling and Dry-out Phenomena
Creators - without role: S.W. Chen - 國立清華大學原子科學院核子工程與科學研究所
M.L. Chai
F.J. Kuo
F.C. Liu
W.K. Lin
J.R. Wang
J.D. Lee
H.T. Lin
C. Shih
Publication Details: Asia-Pacific Conference of Transducers and Micro-Nano Technology 2016 Asia-Pacific Conference of Transducers and Micro-Nano Technology 2016
Identifiers: 9957777622106774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper