- Title
- Thermal Stress Analysis in the J-Lead Solder Joint by Finite Element Method
- Creators - without role
- J.G. Duh - 國立清華大學工學院材料科學工程學系C.M. Sun
- Identifiers
- 9957773564506774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 1997 Pan Pacific Microelectronics Symposium 1997 Pan Pacific Microelectronics Symposium, pp.49-54
Conference paper
Thermal Stress Analysis in the J-Lead Solder Joint by Finite Element Method
1997 Pan Pacific Microelectronics Symposium 1997 Pan Pacific Microelectronics Symposium, pp.49-54
1997
Metrics
1 Record Views