- Title
- Thermal resistance prediction model for IC packaging optimization and design cycle reduction
- Creators - without role
- Guan-Wei ChenChung-Hsiang Hsu宏鍇 王Yan-Cheng LinTang-Yuan ChenChen-Chao Wang
- Publication Details
- IEEE 74th Electronic Components and Technology Conference
- Grant note
- 國科會
- Identifiers
- 9957768554306774
- Academic Unit
- Executive Cross-Discipline Master Program for Intelligent Manufacturing, Office of Academic Affairs, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
Thermal resistance prediction model for IC packaging optimization and design cycle reduction
IEEE 74th Electronic Components and Technology Conference
2024
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