- Title
- Thermo-Electromigration Induced Sn Whisker Growth in Pb-Free Flip Chip Solder Joints
- Creators - without role
- Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系King-Ning Tu
- Identifiers
- 9957774068606774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition 2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition
Conference paper
Thermo-Electromigration Induced Sn Whisker Growth in Pb-Free Flip Chip Solder Joints
2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition 2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition
2008
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