- Title
- Thermo-Mechanical Failure Behavior of Copper TSV Induced by Transient Selective Annealing Technology
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系Y. H. LinC. C. Huang
- Publication Details
- International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2013) International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2013)
- Identifiers
- 9957770410706774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Thermo-Mechanical Failure Behavior of Copper TSV Induced by Transient Selective Annealing Technology
International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2013) International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2013)
2013
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